Siliconware Precision Industries Co., Ltd. (SPIL), a global semiconductor packaging and testing company based in Taiwan, has marked the commencement of construction for its Malaysia P1 plant at Bandar Cassia Technology Park in Penang, northern Malaysia.
This state-of-the-art facility, spread over 8 hectares and representing a USD 1.4 billion investment, is projected to generate nearly 3,000 skilled jobs over the next 15 years. The plant will incorporate advanced technologies for packaging and testing, including wafer bumping and wafer-level chip packaging, aimed at enhancing efficiency and competitiveness within the semiconductor industry. The P1 plant is set to drive innovation, foster semiconductor talent, and bolster technological capabilities in Penang. SPIL has also committed to environmental sustainability, targeting GBI Green Globes Certification and aiming for net-zero carbon emissions by 2050.
This facility significantly enriches Malaysia’s semiconductor ecosystem by creating high-value engineering positions and accelerating the global export of Malaysian products. It positions Malaysia as a pivotal player in the international semiconductor market, thereby sustaining economic growth over the long term. As part of ASE Technology Holding, the world’s largest packaging and testing group, SPIL’s expansion through the P1 plant reinstates its global growth strategy. This initiative not only introduces advanced packaging technologies but also strengthens the packaging and testing industry, driving innovation and economic advancement in Penang and beyond.
(Sources: Penang Property Talk; The Sun)
