Siltronic, a major player in the semiconductor industry, has achieved a significant milestone with the production of the first wafers in its new state-of-the-art 300 mm fabrication facility (fab) in Singapore. This marks a key step in the strategic expansion of Siltronic’s global production network.
The construction of the new fab, which began in 2021, has stayed on schedule and within budget despite numerous challenges, including the global pandemic and supply chain constraints. By the end of 2024, the company expects to have invested around EUR 2 billion in this greenfield project, with additional smaller-scale investments planned thereafter to further enhance production capacity.
The scale of the project is vast, covering an area equivalent to approximately 20 soccer fields. In the mid-term, the new fab is expected to be highly cost-efficient due to the high degree of automation and deployment of digitalization, coupled with its strategic proximity to the existing 200- and 300 mm fabs in Singapore, which will lead to economies of scale and synergies. Notably, the production ramp-up phase is set to begin at the start of 2024.
The fab is strategically positioned to meet both medium and long-term demands in the semiconductor market, driven by global megatrends such as digitalization, artificial intelligence, and electromobility.