United Microelectronics Corporation to Build New Wafer Fab Plant in Singapore

Mar 2022

United Microelectronics Corporation (UMC), a global semiconductor foundry, announced that it would be building a new USD 5 billion advanced manufacturing facility next to its existing 300mm fab (Fab12i) in Singapore. The new fab will be one of the most advanced semiconductor foundries in Singapore, providing UMC’s 22/28nm processes, and the first phase of production would see a monthly capacity of 30,000 wafers, with production expected to commence in late 2024.

UMC has operated as a pure-play foundry supplier in Singapore for over 20 years, and its Singapore location also houses its designated R&D center for advanced specialty technologies. The new fab is expected to help alleviate chip shortage driven by megatrends such as 5G, IoT and automotive trends, and has already secured capacity from various customers who have signed multi-year supply agreements, indicating a robust demand outlook. This is because the fabs are expected to be critical for a broad range of applications, including smartphones, smart home devices, and emerging electric vehicle applications.

(Source: Economic Development Board)

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