Chipbond Technology Corporation, a Taiwan-based semiconductor packaging and testing provider, officially inaugurated its new advanced manufacturing facility in Valdor Industrial Park, Penang state. Representing a total investment of nearly MYR 800 million (USD 200 million), the site marks a major milestone in Chipbond’s global expansion.
The facility is engineered to provide high-value processes, including advanced wafer bumping and wafer-level chip-scale packaging (WLCSP), with an initial monthly capacity of 10,000 wafers and 100 million WLCSP units. Equipped to support flip-chip packaging and testing, the plant offers the flexibility required to meet evolving technological demands and high-end customer specifications for AI, automotive, and mobile applications. The establishment of Chipbond Technology Malaysia Sdn. Bhd. significantly bolsters the nation’s standing within the global outsourced semiconductor assembly and test (OSAT) value chain.
According to the Malaysian Investment Development Authority (MIDA), this investment aligns with the National Semiconductor Strategy (NSS), which seeks to move Malaysia up the value chain toward innovation-led growth and advanced packaging solutions. Beyond increasing industrial capacity, the project focuses on high-level technology transfer and local talent development for its workforce of over 500 employees. Chipbond has further committed to structured training programs and university collaborations to equip Malaysian engineers with the specialized skills necessary for complex semiconductor production.
(Sources: TNGlobal; Malaysian Investment Development Authority)
