Micron Technology has started the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, part of a USD 7 billion investment to expand its semiconductor capabilities. The facility, located next to Micron’s existing operations, is expected to begin production in 2026, with a significant capacity expansion planned for 2027 to meet the growing demand for AI-driven data center solutions.
The new facility will be the first of its kind in Singapore and is set to create around 1,400 jobs initially, with future expansion plans to increase the workforce to approximately 3,000. The facility will focus on packaging development, assembly, and testing operations for Micron’s advanced semiconductor products.
Singapore’s Economic Development Board (EDB) has highlighted the project’s importance in strengthening the country’s position as a key semiconductor hub in the region. The investment is expected to enhance the local semiconductor ecosystem and support the development of AI-related technologies.
Micron also plans to integrate sustainability measures, including greenhouse gas abatement, water recycling, and waste circularity, while leveraging AI-driven automation for production efficiency. The facility is designed to meet Leadership in Energy and Environmental Design (LEED) certification standards, reinforcing Singapore’s focus on sustainable and high-tech manufacturing.
(Source: Globe News Wire)
